English 
Thermal silicone compound (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
- Specifications:
- Net weight: 15 g (23 g in the bottle)
- DImensions: 30 (diameter) x 35 mm
- Color: grey
- Thermal conductivity: > 4.63 W / mK
- Thermal Impedance <0.0087 ° C-in2 / W
- Waight loss after 96 hours @ 100°C: <0.15 %
- Permittivity @ 106 Hz: 2.4
- Volume Resistivity: 5.0 x 10E13 (Ohm*cm)
- Dielectric Strength: 2.5 KV/mm
- Operating Temperature: -30 ~ 280 ° C
- Density: > 3.15 g/ cm3
- Volatility: <0.15 % @100 ?
- The dielectric constant: > 2.4
- Dissipation Factor: <0.005
- Viscosity: 12500 Pa s
- Thixotropic index: 350 ± 10 1/10mm
- Composites: 15% silicone compounds
- Compounds: 35% of carbon
- The compounds of metal oxides: 50%